bullet AUTOMATIC DIE BONDER FOR 12" WAFERS
bullet AD8912SD FOR STACKED DIE APPLICATION
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Robotic wafer handling system for wafers up to 12"
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High accuracy with excellent productivity:
- 320 ms system cycle time
- 25.4 μm @ 3 sigma XY placement
- @ 3 sigma die rotation
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Die size range: 10 x 10 to 1000 x 1000 mil
Universal workholder conversion for various packages
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Flexible indexing clamp for leadframe / substrate thickness 0.1 to 2mm
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2 to 4 mil thin die bonding capability
Real time epoxy pattern inspection and position alignment
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Applications include Mini-BGA, Flex BGA,
- CSPBGA, MLP / QFN, QFP, TQFP, PLCC,
- TSSOP, TSOP, SOIC, SOT and PDIP
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